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BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting Point Africa Design Notebook Brand New Item in Original

SKU: 27706246560

4.0
USD16.73 USD36.73

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  • USA
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Ships within 48 hours · Estimated delivery Aug 6 - Aug 11

Description

Brand New Item in Original Packaging

The regular intake

Antenna: detachable antenna

mixing boards

BAKU BA-5052 BGA Solder Paste for Mobile Phone Repair 35g Tin 35-45 Microns, 138 Celsius Melting Point Africa Design Notebook Brand New Item in Original1. Lead free Solder Paste is a high performance, no clean soldering solution designed for precision electronics assembly and repair. Ideal for BGA applications, it delivers exceptional conductivity, reliability, and efficiency while minimizing post weld residue. 2. Strong Adhesion & Extensibility: Provides robust attachment to solder joints and retains flexibility after cooling, ensuring long term durability. 3. Advanced Membrane Removal Technology:

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
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